Hybrid -- Registered authors can present their work online or face to face New


10th International Conference on VLSI and Applications (VLSIA 2024) will provide an excellent international forum for sharing knowledge and results in theory, methodology and applications of VLSI. Original, unpublished papers, describing research in the general area of VLSI are solicited. Both theoretical and experimental research results are welcome in the following areas, but are not limited to..

Authors are solicited to contribute to the conference by submitting articles that illustrate research results, projects, surveying works and industrial experiences that describe significant advances in the following areas, but are not limited to.

Topics of interest

  • Computer-Aided Design (CAD)
  • Emerging Technologies
  • Low Power and Power Aware Design
  • Nano Scale Electronic Design and Applications
  • Post-CMOS VLSI
  • VLSI Applications(communications, video, security, sensor networks, etc.,)
  • VLSI Circuits
  • VLSI Design
Paper Submission

Authors are invited to submit papers through the conference Submission System by March 02, 2024. Submissions must be original and should not have been published previously or be under consideration for publication while being evaluated for this conference. The proceedings of the conference will be published by Computer Science Conference Proceedings in Computer Science & Information Technology (CS & IT) series (Confirmed).

Selected papers from VLSIA 2024, after further revisions, will be published in the special issue of the following journals

  • International journal of VLSI design & Communication Systems (VLSICS)
  • Signal & Image Processing : An International Journal (SIPIJ)
  • Information Technology in Industry (ITII)
  • Important Dates

    calendar_todaySubmission Deadline : March 02, 2024

    calendar_todayAuthors Notification : March 30, 2024

    calendar_todayRegistration & Camera-Ready Paper Due : April 09, 2024


    Hard copy of the proceedings will be distributed during the Conference. The softcopy will be available on AIRCC digital library.

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